updated: 2012-05-25

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as low as: 7.73EUR

Flex cable Samsung X520 ( original )

as low as: 3.86EUR

Flex cable Samsung C250 ( original )

Microjoint power button Samsung i600 ( original )

as low as: 2.74EUR

Microjoint power button Samsung i600 ( original )

Flex cable Samsung E830 / E838 ( original )

as low as: 8.37EUR

Flex cable Samsung E830 / E838 ( original )

Internal Frame with flex Nokia C7 - 00 ( original )

as low as: 32.53EUR

Internal Frame with flex Nokia C7 - 00 ( original )

Flex cable camera Nokia 6290 ( original )

as low as: 3.86EUR

Flex cable camera Nokia 6290 ( original )

as low as: 8.05EUR

Flex cable Samsung i620 ( original )

Flex cable with connector HTC Legend A6363 ( orginal )

as low as: 11.48EUR

Flex cable with connector HTC Legend A6363 ( orginal )

Flap ( front ) Nokia 8800d Sirocco - white ( original )

as low as: 18.25EUR

Flap ( front ) Nokia 8800d Sirocco - white ( original )

Middlecover Sony Ericsson W850i - black ( original )

as low as: 5.15EUR

Middlecover Sony Ericsson W850i - black ( original )

Cover ( 2in1 ) Nokia N76 - black ( original )

as low as: 17.66EUR

Cover ( 2in1 ) Nokia N76 - black ( original )

Battery cover Nokia N79 - red ( original )

as low as: 4.51EUR

Battery cover Nokia N79 - red ( original )

Cover MS Card Sony Ericsson W900 ( original )

as low as: 2.58EUR

Cover MS Card Sony Ericsson W900 ( original )

Frame middlecover Nokia 5800 - red ( original )

as low as: 7.73EUR

Frame middlecover Nokia 5800 - red ( original )

Middlecover Sony Ericsson W850i - white ( original )

as low as: 4.51EUR

Middlecover Sony Ericsson W850i - white ( original )

Cover back Samsung S5380 Wave Y - silver ( original )

as low as: 10.01EUR

Cover back Samsung S5380 Wave Y - silver ( original )

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Location: Index / Service accesories, Box, Cables / Repairing Tools / Soldering, BGA

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BGA IC Adhesive removing liquid

Price = 14.77 EUR (without VAT)

Weight = 0.2 kg

Negotiate price | Wholesale order?

Description: BGA IC Adhesive removing liquid

BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn not to harm to circuit board and component, even to maintaince worker.

Example of use with unlocking
http://es.youtube.com/watch?v=xOPLgYqBVx8