updated: 2012-05-25
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Flex cable Samsung X520 ( original )
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Flex cable Samsung X520 ( original )
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Flex cable Samsung C250 ( original )
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Microjoint power button Samsung i600 ( original )
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Flex cable with connector HTC Legend A6363 ( orginal )
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 Location: Index / Service accesories, Box, Cables / Repairing Tools / Soldering, BGA
BGA IC Adhesive removing liquid


12 Months warranty
Ask about product

BGA IC Adhesive removing liquid



Price = 14.77 EUR (without VAT)

Weight = 0.2 kg

Product In stock Qty Add it
BGA IC Adhesive removing liquid NO, email me when avaliable - -



Description: BGA IC Adhesive removing liquid

BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn not to harm to circuit board and component, even to maintaince worker.

Example of use with unlocking
http://es.youtube.com/watch?v=xOPLgYqBVx8






 
 
 
 
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