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Flex cable Samsung E830 / E838 ( original )
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Flex cable Samsung i450 ( original )
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Flex cable camera Nokia 6290 ( original )
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Internal Frame with flex Nokia C7 - 00 ( original )
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Microjoint power button Samsung i600 ( original )
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SIM card reader HTC Touch Cruise / P3650 - with flex ( original )
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Flashboard Nokia 6500 ( original )
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Flex cable Samsung X520 ( original )
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Cover ( 2in1 ) Sony Ericsson F305 - white ( original )
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Cover ( front ) Nokia 7373 - pink ( original )
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Camera cover Samsung i8510 ( original )
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Middlecover Sony Ericsson Z610i - pink - used ( original )
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A - cover Nokia 6288 - red ( original )
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Inserts middlecover with buttons Nokia 7390 ( original )
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Middlecover LG KE820 ( original )
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Middlecover Nokia E72 - metal ( original )
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BGA Planting Kit A - B
Price = 8.97 EUR
(without VAT)
Weight = 0.01 kg
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Description: BGA Planting Kit A - B
Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola
Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manual.
List of supported chips:
- Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar...
- CPU do SE T230, T610, T630 and similar...
- Dialog do Siemensow serii x65 and similar...
- CPU Siemens C55, C60, MC60 and similar...
- UEM in Nokia phones
- CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar...
- and more (see all chips in manual link)
In set:
- Planting plate
- Description
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