| |
|
| |
|
| |
|
| |
|
|
|
Flex cable Samsung C250 ( original )
|
|
|
|
|
Flex cable Samsung X520 ( original )
|
|
|
|
|
Flex cable Samsung i620 ( original )
|
|
|
|
|
Microjoint power button Samsung i600 ( original )
|
|
|
|
|
UI board ( function ) Sony Ericsson W760i - with flex cable ( original )
|
|
|
|
|
Camera Flex cable with ear speaker Samsung I900 Omnia ( original )
|
|
|
|
|
Flex cable camera Nokia 6290 ( original )
|
|
|
|
|
Flex cable Samsung i450 ( original )
|
|
|
|
|
Cover ( Part - A ) Nokia E90 - with window ( display glass ) ( original )
|
|
|
|
|
Body Sony Ericsson X1 Xperia - black ( original )
|
|
|
|
|
Logo Sony Ericsson G502 - white ( original )
|
|
|
|
|
Battery cover Sony Ericsson C510 - silver ( original )
|
|
|
|
|
Battery cover Nokia N71 ( original )
|
|
|
|
|
Middlecover Nokia E55 - black ( original )
|
|
|
|
|
Battery cover Nokia 3720c - grey ( original )
|
|
|
|
|
Antenna Cover Nokia 6700s - silver ( original )
|
|
|
|
| |
|
| |
|
|
| |
|
|
BGA Planting Kit A - B
Price = 8.97 EUR
(without VAT)
Weight = 0.01 kg
|
|
Description: BGA Planting Kit A - B
Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola
Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manual.
List of supported chips:
- Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar...
- CPU do SE T230, T610, T630 and similar...
- Dialog do Siemensow serii x65 and similar...
- CPU Siemens C55, C60, MC60 and similar...
- UEM in Nokia phones
- CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar...
- and more (see all chips in manual link)
In set:
- Planting plate
- Description
|
|
|
| |
| |
| |
|
login/register
help
